Cost Effective Equipment

Cost Effective Equipment...

Serving the Semiconductor Industry Since 1987

Originally a division of Brewer Science Inc., the Cee® business owned and staffed by former employees of Brewer Science. Their combined experience in equipment design, wafer processing, operations and technical support totals over 140 years. We are carrying on our history of product quality, performance, and reliability and expanding our focus on customization and technology development.

Cost Effective Equipment

Coating

Cee® Apogee™ Spin Coater

Cee® precision spin coaters feature high spin speed resolution, broad chemical compatibility, and exceptional reliability. The Apogee™ spin coater accommodates substrate sizes up to 200 mm and includes DataStream™ technology.

Cee® Apogee™ Spin Coater
Cee® Apogee™ Bake Plate

Baking

Cee® Apogee™ Bake Plate

Cee® precision bake plates feature excellent thermal uniformity and accuracy, robust process control, and exceptional reliability. The Apogee™ bake plate accommodates substrate sizes up to 200 mm and includes DataStream™ technology.

Cleaning

Cee® 300MXD Megasonic Cleaner

The Cee® 300MXD megasonic cleaner applies uniform acoustic energy to spinning substrates to safely clean and resolve high-density features.
Ideal for post-debonding adhesive cleaning, photoresist developing, and stripping on full-thickness and thinned substrates.
Combines uniform acoustic energy to spray, puddle, and stream dispense for enhanced clear rate and minimized material consumption

Cee® 300MXD Megasonic Cleaner
Cee® Apogee™ Bonder

Bonding

Cee® Apogee™ Bonder

The Apogee™ bonder enables precision temporary bonding for a wide array of wafer sizes and types.
Compatible with substrate diameters from 50 to 300 mm
Ultra flat self-levelling platens ensure a total thickness variation (TTV) as low as 5%
Robust data logging provides detailed process feedback and record keeping

Debonding

Cee® Apogee™ Mechanical Debonder

The Apogee™ mechanical debonder makes it possible to gently “peel” wafers apart while maintaining a low-stress environment.

Cee® Apogee™ Mechanical Debonder
Cee® 1300CSX Slide Debonder

Debonding

Cee® 1300CSX Slide Debonder

Cee® 1300CSX thermal slide debonder enables high-temperature slide-off debonding of thinned compound semiconductor materials in a laboratory or low-volume production setting.

Workstation

Cee® X-Pro II Workstation
The Cee® X-Pro II workstation features customized exhaust enclosures that integrate with stand-alone cabinets to create a virtual clean room environment—perfect for advanced prototyping and pilot-line production. The mini-environment created by the Cee® X-Pro II workstation provides the user with complete control over the environmental conditions within the workstation—including air pressure, velocity, flow, and humidity, as well as temperature stability and uniformity. These enclosures feature fan filter units (FFU) for vertical laminar flow through a particle filter of various efficiencies (E*).

Other features include:
  • Fully assembled and plug-in ready on delivery
  • ULPA, HEPA, or carbon amine filtration
  • Ductless or ducted exhaust
  • Safety-compliant chemical storage
Cee® X-Pro II Workstation