Nanoquest II Ion Beam Etch & Milling
The Intlvac Nanoquest II is an advanced Ion Beam Etch & Milling (IBE) platform designed to meet the latest nanofabrication requirements. With its state-of-the-art features and proprietary design, the Nanoquest II offers unparalleled precision and the ability to dry etch any material, making it an ideal solution for a wide range of applications, including MEMS, optical devices, sensing technologies, photonic devices, RF/microwave components, passive power components, biocompatible devices, and memory devices.
Advanced Nanofabrication Capabilities
The Nanoquest II is specifically engineered to address diverse material removal requirements in innovative devices. With its exceptional precision and ability to etch any material, it provides a reliable and repeatable solution for nanofabrication needs. Whether you are working with MEMS, optical, sensing, photonic, RF/microwave, passive power components, biocompatible devices, or memory devices, the Nanoquest II delivers outstanding results.
Flexible Configuration Options
The Nanoquest II can be configured for ion beam sputtering, e-beam evaporation, or both, offering versatility in deposition techniques. Additionally, it is compatible with a motorized variable angle stage with rotation and temperature control, enabling precise control over the deposition process. For Glancing Angle Deposition (GLAD) applications, dedicated systems or GLAD stage upgrades are available upon consultation with Intlvac.
High-Performance Wafer Handling
The Nanoquest II is equipped with 150mm and 100mm wafer platens for load-locked configurations, including carbon masks for smaller-sized wafers. With a remarkable uniformity of ±3% over a 100mm diameter and a repeatability of ±2% wafer to wafer, the Nanoquest II provides an ideal platform for your fabrication processes. Achieve consistent and reliable results with exceptional precision.
Atomic Layer Etching Capabilities
The Nanoquest II offers direct regulation of key plasma etch parameters, including ion energy, current density, and incidence angle. The system can be configured to match specific applications, whether it requires high aspect ratio and selectivity for masked wafers or high uniformity planarization for substrates with diverse topographies. Recent advancements in Nanoquest II technology include pulsed beam operation, addressing the latest trends in atomic layer etching (ALE) developments.
Experience Advanced Nanofabrication:
Step into the future of nanofabrication with the Intlvac Nanoquest II. Unlock exceptional precision and versatility for your fabrication needs, spanning diverse industries and applications. Upgrade to the Nanoquest II and redefine what’s possible in ion beam etching and milling.
