Probe, Test & Burn-in

Synergie Cad
International Test Solutions

Probe and Test

Cantilever Probe Cards

Epoxy: Mainstream Applications and fine pitch down to 44 μm. Multi-die Testing. Fine pitch Shelf cards.
Blade: Hybrid devices testing, special applications.
Parametric Technology: Parametric testing, low leakage and ultra-low leakage down to 1 FemtoAmp/Volt for Keithley/Agilent and others.

International Test Solutions cleaning solutions are used by semiconductor manufacturers to remove debris and contaminants generated during semiconductor device manufacturing, wafer level testing, and final package test

Probe card clean:

PROBE CLEAN® is a unique, highly cross-linked, nonconductive,
and non-corrosive polymer-based probe cleaning material. It effectively traps the loose debris which accumulates on the probe tip and shaft during wafer-level test. It performs consistently across a temperature range of -50C to 200C and can increase uptime by as much as 50% as well as reducing operator assist during prober setup.
PROBE POLISH® Non-destructively Maintains High Wafer Yield
PROBE SCRUB® Restores Performance and Removes Bonded Debris
PROBE LAP® Precision Lapping Film for Probe Needle Cleaning
PROBE LAP G-TYPE® Cushioned Lapping Film for Reduced Probe Wear
PROBE FORM® Reshapes Probes for Stable Contact Resistance

Chuck cleaning wafers

STAGE CLEAN® was developed to remove and trap the loose debris that accumulates on the wafer chuck. Stage
Clean is a highly cross-linked polymeric material that is mounted on a silicon wafer, and the wafer is run polymerside
down through the tool.
The cleaning action of the polymer occurs when the wafer is clamped on the vacuum chuck. The compliant polymer not only removes defects from the top surface of the chuck, but also from crevices in the chuck, prevents those defects from getting on the backside of wafers.
ETCH CLEAN® Eliminate Helium Leaks due to particles on the electrostatic chuck without Opening Chamber

Test socket clean

TEST CELL CONDITIONER® (TCC) is a patented turnkey cleaning unit designed to remove loose debris as well as embedded oxides from test socket and contactors.
Sometimes called a surrogate cleaning device, or SCD, it facilitates frequent on-line socket cleaning without the need
for equipment downtime or operator intervention.
Cantilever Probe Cards
Probe card clean
Chuck Cleaning Wafer
Test socket clean

Vacuum Traps

MV Multi-Trap

High Capacity, High Efficiency, Vacuum Inlet Trap.
Removes corrosive and abrasive particles that can destroy your vacuum pump
Extends Pumping System Preventative Maintenance periods by up to 2 times or more.

MV Posi-Trap

Foreline Trap Ensures positive flow with no “blow-by”
All stainless steel construction.
Straight-thru and right-angle styles offered.
Wide variety of filter elements to choose from.

Midi-Mist & Maxi-Mist

Stainless steel construction resists corrosion.
Protects environment from vacuum pump exhaust.
Drain plug for recovering pump fluids.
Simple disassembly and cleaning.
High-capacity coalescing filters drain oil into a large reservoir for easy recovery.

Designed for large capacity vacuum pumps
Protects your vacuum pump and pump fluid.
Reduces maintenance costs.
Prolongs pump and fluid life.
Removes acids, alkalis, moisture, particles and other corrosive or contaminating materials.


Vacuum Inlet trap with transparent Sump
Select inserts for trapping particles, water, oil, or corrosive chemicals.
Transparent sump shows when to change insert without removing from vacuum system.


A compact, portable, self-contained system for continuously filtering mechanical vacuum pump fluid.

Degassing Chamber

Vacuum degassing chamber reduces pressure above the surface of the material to permit escape and subsequent removal of entrapped air and other gases that could induce failure of the final product.


SiSTEM Technology Limited
Grafton Suite, 
Caswell Science & Technology Park
NN12 8EQ , UK


+44 1327 317621

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