High Vacuum Deposition and Etch Systems

With a long history and broad experience as a high vacuum system designer and builder, Intlvac can provide you with prototype and production thin film coatings, or a deposition or etch system for your process. Their years of experience and knowledge are the key to your success.
Intlvac
INTLVAC ICARUS INDIUM BUMP DEPOSITION SYSTEM

The Intlvac ICARUS Indium Solder Bump Deposition System is optimised for high throughput production, with low maintenance and quick turnaround on parts. From pushing the "Go" button to pulling out a finished wafer with 2µ of spit-free coating takes less than 90 minutes with our automatic single carrier load-lock design. A load-lock cassette system can reduce this time even more.

The Intlvac ICARUS Indium Deposition System has the capacity of hundreds of depositions without the need to open the main chamber. When it is time to refill the indium, it only takes a few minutes to exchange the empty indium crucible with one that is pre-charged. Note the evolution of Intlvac's technology with superior precision and uniform deposition front.

ICARUS can handle any size and shape of wafer up to 200mm in diameter, with custom carriers designed to meet the need of the product. Standard carriers handle 3 x 75mm, 2 x 100mm, 1 x 150mm, with options for witness pieces and 200mm without.

Image
Refurbish & Retrofit
AUTOMATIC LOAD-LOCK

The Intlvac ICARUS Indium Solder Bump Deposition System comes equipped with either an automatic or manual load-lock for single and multi-wafer configurations. The load-lock is designed to transfer and pre-condition single wafers up to 200mm. The load-lock chamber has a wafer cleaning position to facilitate the removal of light surface contamination, oxides and water vapour from the wafer without physically etching it. Once the wafer is cleaned, the carrier transfers it into position.

SUPERIOR DEPOSITION CONTROL

The Intlvac ICARUS Indium Solder Bump Deposition System geometry ensures a very flat and uniform deposition front for superior 'lift-off' capability. This tool provides the environment and deposition control to achieve the thickness, fill and material properties for a variety of successful solder bump designs.

Image
INTERNAL DEPOSITION SHIELDS

The Intlvac ICARUS Indium Solder Bump Deposition System shield and chamber have been designed to maximise reclamation with strategically positioned and easily removable internal deposition shield. Maintenance is easy with removable liners that can be swopped out and replaced with the spare set that come with the system.

HELIOS* EVAPORATION SOURCE STAGE

Proprietary Intlvac evaporation source
Large molybdenum crucible, thick wall design for long life operation
Extremely stable evaporation rate
Crucible may be loaded in place or removed and loaded in an alternate location
* Helios - patent pending

Image
Image

Nanoquest – Ion Beam Etch

Nanoquest Pico:
A compact, low-cost Ion milling platform for advanced R & D
Process methods: Ion Beam Etching (IBE) Reactive Ion Beam Etching (RIBE)
Nanoquest I
Nanoquest I:
A compact, low cost platform for advanced Ion beam process

Process methods:
Ion Beam Etching (IBE)
Ion Beam Sputter Deposition
Ion Beam Assisted Deposition (IBAD)
Reactive Ion Beam Etching (RIBE)
Chemically Assisted Ion Beam
Etching (CAIBE)
Nanoquest II:
Ion Beam Etch platform for wafers up to 8 inches. Options Include:
IBS Deposition
Sputter Deposition
In-situ Camera
S.I.M.S. End-point Detection
Load-lock
Nanoquest II
Nanoquest III
Nanoquest III:
Multi-substrate ion milling system with next-gen RF ICP ion source.
Features
22cm RF ICP Ion Source
Up to 3×6” Planetary
S.I.M.S. End-point Detection
Intlvac Pleiades:
Is a modular, multi-chamber array featuring customizable configuration for complex processes under vacuum.

Its enables the use of process modules such as:

  • Ion Beam Etching & Sputtering
  • E-Beam Evaporation - Lift Off
  • Thermal Evaporation
  • Oxide & Fluoride Evaporation
  • Magnetron Sputtering Oxides & Nitrides
  • Magnetron Sputtering Metals
  • Atomic Layer Deposition
Intlvac Pleiades
Nanochrome Pico

Nanochrome – Physical Vapour Deposition

Nanochrome Pico:
A compact, low-cost platform for advanced Thin Film Coating
Process methods:
Magnetron Sputtering
E-beam Evaporation
Thermal Evaporation
Ion Assisted Deposition
Knudson Cell Evaporation
Nanochrome I:
An R&D/Pilot Physical Vapour Deposition System Process methods:
Co-Evaporation
Multi-Layered E-beam Deposition
Ion Beam Assisted Deposition (IBAD)
Thermal Evaporation)
Planar Magnetron Sputtering
Nanochrome I
Nanochrome II
Nanochrome II:
An R&D/Pilot Physical Vapour Deposition System. Process methods:
Co-Sputtering
Ion Beam Assisted Deposition (IBAD)
RF, AC & Planar Magnetron Sputtering
Nanochrome IV:
Plasma Assisted Reactive Magnetron Sputtering
Key Benefits:
Exceptional process repeatability
Stable deposition rates up to 10 Å/Sec
Very low arcing
Capable of producing films with 100+ layers
Optional load-lock operation
Nanochrome IV
PECVD: Diamond Like Carbon
PECVD: Diamond Like Carbon:
The Intlvac DLC system fully automated, suitable for applications in Optics, Bio & Mechanical Engineering.

DLC is available on wide variety of substrates:

IR Optics: Silicon, Germanium, Chalcogenides

Plastics: Ultem, Polycarbonate, Polyimide, PEEK

Glass: Crown Glass, UVFS, SF11, Sapphire

Metals: Aluminium, Copper, High-carbon Steel

Gridless End-Hall Ion Sources

For Ion Assisted Thin Film Deposition & Substrate Cleaning
Mark I Ion Source
The Mark I End-Hall is ideal for small research and development and pilot production e-beam coating systems.

Features:
  • Reactive gas compatible
  • Low contamination
  • Rugged and reliable
  • Ideal for small systems
Mark II Ion Source
The Mark II is the industry standard source for optical coating systems and is the most widely used ion assist source.

Features:
  • Production proven design
  • Reactive gas compatible
  • Low contamination
  • Numerous options available
Water-Cooled Mark II Ion Source
The Water-Cooled Mark II Ion Source adds efficient cooling for processes requiring low temperatures and reduced cycle times. Engineered and tested to withstand rigorous production environments, the Water-Cooled Mark II has a distinctive anode design which promotes excellent heat transfer out of the vacuum chamber and away from substrates

Water-Cooled Features & Benefits
  • Dramatically reduced substrate temperatures
  • Elimination of cool-down prior to venting
  • Greater ion beam stability/control
Results
  • Reduced stress
  • Increased production throughput
  • Reproducible film properties
Ion Sources - MK I
Mark II – HCES
Mark II – HCES
The Mark II ion source is configured with a Hollow Cathode Electron Source (HCES) to permit long run times with reactive gases while maintaining consistent and reliable operation. Ideal for oxygen and other long reactive processes, the HCES provides sufficient electron emission for ionization and beam neutralization. When combined with the Water-cooled anode, the Mark II-HCES provides the coolest operation of the Mark II Series.

Benefits:
  • Filament less operation
  • Reduced contamination
  • Cool source operation
Gridless Ion Source Power Supplies

Reverse compatible
  • Remote I/O is pin to pin compatible Faster Mark I & Mark II Power Supply
  • operation & response
  • Digital & Switching technology
  • Quick start (learn)
  • More stable operation
  • Dual regulation
  • More reliable
  • Low stored energy & output limits
  • Longer filament lifetime
  • Filament soft-start
  • Triple filament lifetime option
Gridless Ion Source Power Supplies
Benefits of A Water-Cooled anode
Benefits of A Water-Cooled anode
Benefits of A Water-Cooled anode
Promote amorphous/crystalline growth
  • Near bulk indices
Increased packing density
  • Eliminates water absorption
  • Low spectral shift
  • Hard, environmentally durable coatings
Improved Step Coverage
  • Preferred grain sizes and boundaries
  • Minimizes scatter and absorption
Improved Adhesion
  • Films adhere to substrates and each other
  • Control Stoichiometry
  • Predictable and reproducible films
Hollow Cathode Electron Source Retro-fit Kit
Used instead of a tungsten filament, the Hollow Cathode Electron Source (HCES) ensures a Contamination-free environment and reduces maintenance intervals. Intlvac’s new Hollow Cathode Tip can run for over 150 hours before replacement. Our retro-fit kits come complete with everything you need to make the switch.
Hollow Cathode Electron Source Retro-fit Kit
Gridless Ion Source Power Supplies
Gridless Ion Source Power Supplies

Reverse compatible
  • Remote I/O is pin to pin compatible Faster Mark I & Mark II Power Supply
  • operation & response
  • Digital & Switching technology
  • Quick start (learn)
  • More stable operation
  • Dual regulation
  • More reliable
  • Low stored energy & output limits
  • Longer filament lifetime
  • Filament soft-start
  • Triple filament lifetime option
Refurbish & Retrofit
Commonwealth Scientific & Veeco Ion Tech Mark I and Mark II sources

Upgrade your old Commonwealth Scientific or Veeco Ion Tech system to a state of the art Ion source and modern control system utilizing a LabVIEW interface and data logging of your process. Substrate stages can also be refurbished with new parts made to the original specifications

Link to INTLVAC Ion Source Brochure:
Download Brochure
Refurbish & Retrofit
The nanochrome family of systems are used to make:
  • Indium Bump bonding for fabrication of focal plane arrays
  • Ohmic contacts for III-V and II-VI materials with diffusion barriers
  • Precision optical coatings by Ion Beam and Magnetron Sputtering
  • Optical filters, Gratings
  • Anti-reflective and Anti-scratch Coatings for IR optics
  • Semiconductors & Dielectric Materials
  • Superconductors

SiSTEM Technology Limited
Grafton Suite
Caswell Science & Technology Park
Towcester
Northamptonshire
NN12 8EQ
United Kingdom

Email:
sales@sistemtechnology.com

Telephone:
+44 (0)1327 317 621

Get in touch