Founded in 1979 in Silicon Valley, USA, Fortrend has served as an innovative original equipment manufacturer for the Semiconductor and PV industries. For over thirty five years Fortrend products have become the crucial automation connections among different processing equipment.
Fortrend continues to develop its innovative automation technology for extensive use in the semiconductor industry. Fortrend is an industry leader in the design and manufacturing of automated SMIF handling equipment and its SCARA robots.
Vacuum and Convection Ovens
FLO-10C-12W Thermal Chamber
performance ISO Class 4 Cleanliness oven for wafers up to 300mm and temperatures up to 250C ideal for applications such as;
- Moisture removal
- Single layer thermal processing
Its superior ISO Class 4 cleanness is suitable for baking processes of semiconductor wafers, MEMS, LED and touch panels.
Wafer Baking Oven System SIO-300-200-2
load ports, wafer robot, cassette robot, YES series oven and control unit
200mm cassette manual/auto load available
Temperature Range: Ambient~250 degree C
Uniformity: ± 3 degree
Cleanness of System: Class 1
Cleanness of Oven: Class 10
N2 bake oven
High Temperature Vacuum Cure Oven SIO-300-450-1 and SIO-300-450-2( dual chamber)
Process capabilities are;
- Polyimide Cure
- BCB cure
- Photoresist Cure
- Copper Anneal
- Copper Oxide Removal
200mm Wafer auto load available Continuous horizontal lamina flow of N2
Low O2 < 10 ppm
Process temperature range 150~450 °C
Temperature uniformity better than ± 3.5 °C
Maximum heating ramp 8°C/min, and cooling 6°C/min (depends on chamber temperature)
Reticle Storage and Handling Systems
eRack and N2/XCDA Charger
Supports RF ID, IR and BCR/OCR reader/writer
SECS I / SECS II and TCIP
N2/XCDA Charger protects wafers from oxidation and masks from pollution ( low humidity, low O2, Low NH3+)
Lamina-II series EFEM/Sorter
SEMI E78 ESD “Level 1” standard
Load port options: 150mm and 200mm RSP,
ASML, Nikon, Cannon, HOYA, Toppan, DNP,
TMC, ShinEtsu, DMS, and more
Other options: BCR/OCR reader, IR, RFID reader/writer, Turntable, SECS/GEM Interface
POS 200 - 200mm Reticle SMIF Pod Opener
Barcode reader for Mask ID reading (Optional)
Comparison of Pod ID and Mask ID (Option)
PLM-200 EUV Pod Opener
Opens Standard E100 RSP and EUV E152 Outer Pods Door
Mounts directly into a process tool or to a manual load port adaptor to convert open station to a
SMIF compatible station.
Optional RFID reader/writer
Reticle Shipping box Openers.
Toppan, IBM Blue and DMS type Clam shell type shipping Boxes.
Also Nikon and Canon reticle cartridge openers,
DMS bare mask cartridge openers and lift lid box openers.
All with modular design for easy integration and servicing.
ISO Class 1 cleanliness.
Handling and Automation
Mass wafer transfer systems
One, two, three and four stage systems
Class 1 compatible: <0.1 PWP @ 0.16 microns CE/S2/S8
Options: Boat Inserts, Integrated Notch Finder and Flat Finder, Counter, Vespel Contact Points,
Temperature Sensor, Ionizer, Lexan Side Covers with ESD Coating, Foot Switch, Key Switch,
Green LED, EMO
Applications: Furnace, wet bench, CMP, ion implantation, metrology
PLUS 500 pod load/unload systems
Five diverse PLUS models to meet all SMIF retrofit requirements.
Better than Class-1 cleanliness. Worldwide installations.
All tool designs meet SEMI E-15 SMIF load port interface standards
Sorters and EFEMs
Options include custom end –effectors, dual or single arm Scara robots, flip arm robotics, integrated mapping, pre-aligners, OCR reader and bright light inspection.
InforTrac® Hardware Solutions for Lot ID Tracking System.
Integrated IR Reader/Writer
Automatic tag detection
Supports SmartTag Protocols
Serial and SECS I/II protocols
Support multiple antennas with one reader/writer
LMS Lot Management System.
The Little Green Furnace (LGF)
The LGF has an 8” flat zone, and a boat loader mechanism that is contained in the furnace cabinet, making the unit very compact.
The LGF, together with its ICCI controller and GMI Host, offers the best software package available.
LGF offers great performance – fast heat up cooldown, and good temperature uniformity because of 5-zone top-to bottom design.
The LGF is specifically designed to allow users to change quartz components quickly and easily, useful for labs that need to process incompatible materials.
And since the furnace is small, the quartz is much less expensive than conventional furnaces.
Furnace Size: 41”x32”x24” (door closed), 65”x32”x24” (door open).
Boat loader: Cantilever style, servomotor driven. Speed adjustable from 2” to 30” per minute.
Heat-up rate: up to 50° C per minute.
Cool-down rate: 15° C per minute (1000 oC to 500 oC).
Maximum Temperature: 1200° C.
Wafer Size: Up to 150 mm standard.
Wafer Load: 25
Thermocouples: 5-zone spike and profile. All TC’s included
Over temperature protection: 3-zone, with manually settable overtemp limits, and digital display.
Temperature stability: +/- 2 o C over a 24-hour period.Processes: Configurable for thermal oxidation, diffusion, annealing, LPCVD, etc. Up to 3 MFC’s, valves, etc. housed in gas cabinet within footprint shown above.