P7000 Wafer Alloy/Anneal System
Explore the P7000 Wafer Alloy/Anneal System, a sophisticated solution by C&D Semiconductor, tailored specifically for the metal ohmic wafer alloying essential in the semiconductor industry. This system is designed to meet the unique needs of processing 50mm–200mm GaAs, InP wafers, and high-temperature silicon, providing a cost-effective alternative to Rapid Thermal Annealing (RTA) with significantly higher throughput.
Optimised Alloying Performance
The P7000 is renowned for its engineering simplicity and ease of use, making it an ideal choice for facilities aiming to enhance their alloying processes without the complexities and high costs associated with RTA systems. It supports processing temperatures up to 500°C, ensuring optimal conditions for a variety of alloying requirements.
Key Benefits
Closed Chamber Inert Atmosphere: Eliminates the need for RTA, allowing for multiple gases with pump-out capability.
Uniform Heating: Proximity pins ensure even heating and reduce backside contamination.
Efficient Cooling: Features gentle wafer cooling and handling, maintaining the integrity of processed wafers.
Cost-Effective High Throughput: Offers twice the throughput of standard RTAs at a fraction of the cost.
Advanced Features for Superior Control
SmartPro GUI: Simplifies recipe creation and streamlines operations.
Dual-Size Bridging: Allows processing of various wafer sizes without hardware adjustments.
CE Marked: Ensures compliance with European safety standards.
Enhanced Throughput and Reliability
The P7000 not only doubles the throughput compared to conventional RTAs but also does so with consistent reliability and quality. It can process up to 23 wafers per hour in parallel mode, making it a highly productive asset for any semiconductor production line.
Controlled Environment and Gentle Handling
The P7000 Alloy System is designed with a controlled environment that mimics the advantageous features of RTAs:
Controlled Atmosphere: A lid prevents airflow disruption during processing and allows for precise gas management.
Gentle Wafer Handling: Wafers are processed without contacting the hotplate surface, preventing backside contamination.
System Customisation and Integration
SECS/GEM Compliance: Ensures seamless integration into existing factory systems.
Barcode and Recipe Download: Enhances traceability and repeatability of processes.
The P7000 Wafer Alloy/Anneal System from C&D Semiconductor provides a highly effective, efficient, and user-friendly solution for metal ohmic alloying. With its advanced features and cost-effectiveness, the P7000 stands out as a superior choice for semiconductor manufacturers looking to optimize their alloying processes while maintaining high standards of quality and uniformity.
For more information on how the P7000 can enhance your production capabilities, contact SiSTEM Technology today. This system not only meets the specific needs of today’s semiconductor industry but also offers the flexibility and performance to adapt to future demands.
